The conductivity of PI gold plating film in high-performance computing devices

With the rapid development of information technology, the demand for high-performance computing (HPC) devices is increasing day by day. These devices not only need to process massive amounts of data, but also need to ensure the speed and stability of signal transmission. In order to meet these requirements, the selection of materials has become particularly important. Polyimide (PI) films are widely used in the electronics industry due to their excellent mechanical properties, heat resistance, and electrical insulation. However, in certain specific application scenarios, such as connector contacts or micro circuit boards, the requirements for conductivity are more stringent. At this point, forming a thin and uniform gold film on the PI substrate through techniques such as physical vapor deposition (PVD) can greatly improve its conductivity. This article will explore the research and application of Advanced Institute (Shenzhen) Technology Co., LtdPI gold-plated filmTechnology and its performance in high-performance computing devices.

Characteristics of PI Gold Plated Film

1. High conductivity

Gold is a metal with excellent conductivity, with a resistivity as low as 2.44 × 10 ^ -8 Ω· m. When covered with nanoscale thickness on the surface of PI, it can provide a continuous and stable conductive path, significantly reduce contact resistance, and ensure smooth current flow, which is crucial for high-frequency signal transmission.

2. Corrosion resistance

Unlike other metals that are easily oxidized or affected by environmental factors, gold has excellent chemical stability and corrosion resistance. This means that even in environments with high humidity, PI gold plating film can maintain good conductivity for a long time, extending the service life of electronic components.

3. Thermal stability

PI itself has excellent high-temperature resistance, and the presence of a gold layer will not have a negative impact on it. On the contrary, in high-temperature environments, gold can also serve as a heat dissipation medium to help dissipate heat, thereby maintaining the temperature balance of the entire system and ensuring stable operation of the equipment.

Research achievements of Advanced Institute (Shenzhen) Technology Co., Ltd

Advanced Institute (Shenzhen) Technology Co., LtdFocusing on the research and application of new materials, especially in the field of electronic materials, we have achieved multiple breakthroughs. In response to the challenges posed by high-performance computing devices to conductive materials, the company has successfully developed a new type of PI gold plating film technology. This technology utilizes advanced PVD technology to achieve precise control of the gold layer without affecting the original characteristics of PI, ensuring that each layer of coating is uniformly consistent and free of pinhole defects. In addition, the adhesion between the coating and the substrate has been optimized to prevent delamination caused by stress concentration.

Application examples

In practical applications, this improved PI gold plating film has been proven to play an important role in various aspects such as high-speed data transmission interfaces, RF modules, and high-density interconnect boards. For example, in the design of a high-end server motherboard, adopting the PI gold plating film solution provided by the Advanced Institute not only improves signal integrity and reduces electromagnetic interference, but also simplifies the production process and reduces manufacturing costs.

conclusion

in summary,PI gold-plated filmWith its excellent conductivity and reliability, it plays an indispensable role in high-performance computing devices. In the future, with the rapid development of emerging fields such as 5G communication and artificial intelligence, the demand for high-performance electronic components will continue to increase. Enterprises like Advanced Institute (Shenzhen) Technology Co., Ltd., which are committed to technological innovation, will undoubtedly make greater contributions to promoting industry progress.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.