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Current:Home >News >Frontier News >PET copper plating technology has gradually become a new favorite in the field of circuit board manufacturing, and its process advantages are mainly manifested in the following aspects
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Frontier News

PET copper plating technology has gradually become a new favorite in the field of circuit board manufacturing, and its process advantages are mainly manifested in the following aspects

Time:2024-03-06Number:1100

PET Copper Plating TechnologyPolyethylene Terephthalate Copper Plating is an emerging flexible circuit board manufacturing process that has many significant advantages compared to traditional copper foil processes. Against the backdrop of rapid development in today's high-tech electronics industry, PET copper plating technology has gradually become a new favorite in the field of circuit board manufacturing, with its process advantages mainly manifested in the following aspects.

Higher flexibility

The traditional copper foil production process requires processing on the entire copper foil, which limits the flexibility of design. The PET copper plating technology can directly coat copper on thin PET films and print various circuit patterns according to needs, greatly improving design flexibility. For example, users can customize circuit boards of different shapes and layers according to product requirements to meet personalized needs.
镀铜膜

Cost savings

Compared to traditional copper foil craftsmanship,PET Copper Plating TechnologyWhen making circuit boards, there is no need to use a large amount of copper material, so the cost is lower. According to market research data, the cost of circuit boards produced using PET copper plating technology is reduced by nearly 20% compared to traditional processes, saving a lot of costs during mass production.

Better performance stability

The circuit boards produced by PET copper plating technology exhibit excellent performance stability. Due to the tight bond between copper and PET film, it has better elasticity and durability, and is less prone to cracking and fracture during transportation and use. Traditional copper foil circuit boards are prone to breakage when bent or subjected to force, leading to circuit board failure.

Better environmental friendliness

With the increasing awareness of environmental protection in society, environmental requirements are becoming increasingly strict.PET copper platingCompared to traditional copper foil processes, this technology has better environmental friendliness. The PET material itself meets environmental requirements, and the PET copper plating technology generates less waste during the production process, which is in line with the concept of green manufacturing.

Higher production capacity

Due to the automated production equipment and high production efficiency of PET copper plating technology, large quantities of orders can generally be quickly completed. Compared to traditional copper foil technology, the production cycle is shorter and can meet market demand faster.

Overall, PET copper plating technology has shown outstanding performance in flexibility, cost, performance stability, environmental friendliness, and production capacity compared to traditional copper foil processes, gradually becoming the mainstream trend in the circuit board manufacturing industry. In the future development, PET copper plating technology is expected to be further improved and developed, bringing more innovation and possibilities to the design and manufacturing of electronic products.
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