Efficient protection, leading the future with intelligence - Advanced Institute's electromagnetic shielding PI gold-plated film leads the new trend of technology

With the rapid development of emerging technologies such as 5G, IoT, and artificial intelligence, electronic devices are rapidly evolving towards miniaturization, slimness, and multifunctionality. At the same time, electromagnetic interference (EMI) has become increasingly prominent and has become one of the key factors restricting the improvement of equipment performance. In this context, a new type of material that integrates electromagnetic shielding, high temperature resistance, and high conductivity——PI gold-plated filmemerge as the times require. This article will provide a detailed introduction to this innovative product independently developed by Advanced Institute (Shenzhen) Technology Co., Ltd., revealing the technical secrets behind it.

product overview

Electromagnetic shielding PI gold plating filmIt is based on polyimide (PI) film and forms a uniform and dense gold layer on its surface through precise gold plating process, thereby endowing the film with excellent electromagnetic shielding performance, high temperature resistance, and good conductivity. This product not only meets the strict requirements of modern electronic devices for electromagnetic compatibility, but also maintains stable performance in extreme environments, making it an indispensable ideal material for the new generation of high-tech electronic products.

detailed parameters

• Substrate material: High performance polyimide (PI), with excellent dielectric properties and mechanical strength.
• Film thickness: 5 μ m to 125 μ m, can be customized according to specific customer needs.
• Gold plating thickness: 0.02 μ m to 0.1 μ m, ensuring good conductivity and shielding effect.
• Temperature resistance range:- Suitable for various extreme environmental conditions ranging from 200 ° C to 260 ° C.
• Shielding effectiveness: In the frequency range of 1GHz to 18GHz, the average shielding effectiveness is greater than 80dB.
• Conductivity: The conductivity of the gold plating layer can reach over 40MS/m, effectively reducing signal transmission losses.
• Tensile strength: greater than 200MPa, with excellent mechanical strength, suitable for complex processing techniques.

Production process

PI gold-plated filmThe production process is divided into multiple key steps. Firstly, high-quality PI film is selected as the substrate, and the mechanical properties of the film are improved through high-temperature stretching process. Then, using advanced surface treatment techniques, the PI film is pre treated to ensure good adhesion between the subsequent gold plating layer and the substrate. Next, in the dust-free workshop, vacuum evaporation orSputtering coating technologyUniformly deposit a gold layer on the surface of the PI film. This process requires strict control of parameters such as air pressure and temperature inside the coating chamber to achieve the expected thickness and quality of the gold plating layer. Finally, through a series of strict quality inspections, including visual inspection, thickness measurement, conductivity testing, etc., it is ensured that each roll of electromagnetic shielding PI gold-plated film meets high standard requirements.

Product advantages

The biggest highlight of the electromagnetic shielding PI gold plating film is its excellent comprehensive performance.Polyimide filmIt already has excellent high temperature resistance and can work stably for a long time under extreme temperature conditions; The surface gold plating layer not only endows the film with good conductivity and electromagnetic shielding effectiveness, but also greatly enhances its corrosion resistance and wear resistance. In addition, the material is lightweight, flexible, and easy to process into different shapes, making it suitable for various application scenarios and greatly expanding its application range in the electronics field.

application area

The electromagnetic shielding PI gold-plated film, with its unique advantages, is widely used in various high-tech fields such as aerospace, military communication, medical equipment, etc. In the aerospace field, this material can be used to manufacture key components such as aircraft radar covers and satellite antenna covers, effectively reducing the impact of external electromagnetic interference on aircraft communication systems; In the field of military communication, it is used to make electromagnetic shielding covers, cable sheaths, etc., to ensure the safety and reliability of information transmission; In the field of medical devices, its excellent biocompatibility makes it an ideal choice for manufacturing implantable medical devices.

In short, electromagnetic shielding PI gold plating film, as a new material with high performance and wide application prospects, is gradually becoming an important force in promoting the innovation of the electronics industry. With the continuous advancement and improvement of technology, we have reason to believe that this innovative achievement will play a more important role in the future, leading the electronic materials industry to a higher level.