High power and high brightness LED conductive silver adhesive: a key factor in efficient packaging technology

High power and high brightnessLED conductive silver adhesiveThe packaging technology plays a crucial role in modern electronic manufacturing industry. Conductive silver paste, as an indispensable material in the LED packaging process, has strict requirements for the conductivity, thermal conductivity, and bonding strength of conductive silver paste.

　　Advanced Institute Technology CompanySpecially developed for high-power and high brightness LED packaging requirementsResearch Platinum Series Conductive Silver AdhesiveIts thermal conductivity reached 25.8 and its shear strength reached 14.7. This conductive silver paste not only has good conductivity, but also excellent thermal conductivity and adhesion, fully meeting the requirements of high-power and high brightness LED packaging.

first,Conductive silver adhesiveThe thermal conductivity is crucial for high-power LED packaging. During the process of LED emission, a large amount of heat is generated. If the thermal conductivity is poor, it can lead to a decrease in the luminous efficiency of the LED and even damage it. The conductive silver adhesive developed by Advanced Institute Technology Company has a high thermal conductivity, which can quickly transfer the heat emitted by the LED and ensure its normal operation.

Secondly, shear strength is an important indicator for measuring the bonding performance of conductive silver paste. In the LED packaging process, conductive silver paste needs to successfully bond the chip and base together and withstand external forces. If the shear strength is insufficient, it is easy to cause the detachment of the packaging material, which in turn affects the normal use of the LED. The shear strength of the research platinum series conductive silver adhesive has reached 14.7, which can provide reliable material bonding performance and ensure the firmness of LED packaging.

In addition, the conductive silver adhesive developed by Advanced Institute Technology Company also exhibits excellent rheological and moisture absorption properties. Rheology refers to the ability of a material to deform under external forces, which is crucial for steps such as material coating and filling during the bonding process.Research Platinum Series Conductive Silver AdhesiveIt has good rheological properties and can be effectively coated on the interface between the chip and the base during the LED packaging process. Meanwhile, its low moisture absorption can prevent the material from getting damp and causing problems during long-term packaging.

In summary, the Advanced Institute Technology Company has developedResearch Platinum Series Conductive Silver AdhesiveIt exhibits excellent characteristics in thermal conductivity, shear strength, rheology, and moisture absorption, making it very suitable for packaging high-power and high brightness LEDs. Its emergence provides strong support for the development of the LED industry, promotes the progress and innovation of LED packaging technology, helps improve the quality and performance of LED products, and promotes the widespread application of LED in lighting and other fields. With the continuous development of technology, it is believed that the research and application of LED conductive silver paste will reach a new level, bringing new opportunities and challenges to the sustainable development of the LED industry.