Solution to Particle Agglomeration in Low Temperature Sintering Nano Silver Paste

overview

Low temperature sintering nano silver pasteIt is highly favored due to its excellent performance in the field of electronic packaging. However, in practical applications, sometimes there may be problems with the agglomeration of nano silver particles, which not only affects the conductivity of the product, but also reduces the adhesive strength. This article will explore the reasons for this phenomenon and propose effective solutions.

Low temperature sintered nano silver paste (hereinafter referred to as "silver paste") is a material that can achieve good conductivity at lower temperatures and is widely used in fields such as flexible circuits and solar cells. However, nanosilver particles may clump during storage or use, resulting in insufficient sintering and affecting the performance of the final product. This article explores the causes of agglomeration phenomenon through experimental data and provides improvement measures.

Experimental Materials and Methods

The silver paste used in the experiment isResearch Platinum BrandlowWarm sintered nano silver pasteProvided by Advanced Institute (Shenzhen) Technology Co., Ltd. The experimental materials include copper foil, stainless steel sheets, etc. All materials undergo strict surface treatment before the experiment to remove oil stains and other impurities.

Experimental Design and Implementation

In order to conduct researchAgglomeration phenomenon of nano silver particlesWe have prepared two types of silver paste samples with different processing states: one is the untreated raw sample, and the other is the optimized sample after processing. Two samples were cured under the same conditions and tested for conductivity and adhesive strength after curing.

Experimental results and analysis

Analysis of the causes of agglomeration phenomenon

Through microscopic observation of the original sample, we found thatnano silverThere were varying degrees of aggregation observed in the silver paste. This gathering is mainly caused by the following reasons:

• Improper storage conditions: If silver paste is stored in a humid or high-temperature environment, nano silver particles are prone to agglomeration.
• Insufficient mixing: Insufficient mixing before use can result in uneven distribution of silver nanoparticles, leading to agglomeration.
• Formula issue: Certain additives may promote particle aggregation under specific conditions.

Solution and its effectiveness verification

In response to the above reasons, we have taken the following measures to prevent and solve the problem of clumping:

• Improve storage conditions: Ensure that silver paste is stored in a dry and cool environment, and regularly check the sealing of the packaging.
• Strengthen the stirring process: thoroughly stir before use to ensure uniform dispersion of silver nanoparticles.
• Adjust formula: Optimize the formula and add an appropriate amount of dispersant to prevent particle aggregation.

Through testing the optimized samples, we found a significant reduction in clumping phenomenon. The specific data is as follows:

• Original sample: The conductivity test showed a resistivity of 3 Ω/□ and an adhesive strength of 2MPa.
• Optimized sample: Conductivity testing showed a decrease in resistivity to 1 Ω/□ and an increase in adhesive strength to 4 MPa.

It can be seen that the optimized silver paste has significantly improved conductivity and adhesive strength, indicating that the problem of agglomeration has been effectively solved.

conclusion

By comparingLow temperature sintering nano silver pasteIn the study of clumping phenomenon, we found that clumping is mainly caused by improper storage conditions, insufficient mixing, and unreasonable formulation. By improving storage conditions, strengthening the stirring process, and adjusting the formula, measures can be taken to effectively prevent and solve the problem of agglomeration, thereby enhancing the conductivity and adhesive strength of silver paste.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.