Solve the problem of metal wiring detachment caused by poor adhesion between filling gold paste and substrate

In modern electronic manufacturing, hole filling technology is one of the important means to improve the density and reliability of printed circuit boards (PCBs). However, in the actual production process, a common problem is the poor adhesion between the filling gold paste and the substrate, which leads to the easy detachment of metal wiring and seriously affects the quality and service life of the PCB. This article aims to explore this issue and propose effective solutions.

Problem description

Filling gold pasteMainly used to fill blind holes or through holes on PCBs to achieve electrical connections between different layers. When the adhesion between the filling gold paste and the substrate (such as FR-4, CEM-3, etc.) is insufficient, the metal wiring may detach due to external forces or environmental changes, thereby affecting the functionality of the entire circuit.

Experimental Materials and Methods

This study used products produced by Advanced Institute (Shenzhen) Technology Co., LtdYanbo brand YB8106 filling gold pasteConduct experiments. Firstly, observe the effect of changing the pre-treatment steps, curing conditions, and ingredient ratios in the filling gold paste formula on adhesion. During the experiment, all samples underwent the same pretreatment process, including surface cleaning, activation treatment, etc.

Experimental results and analysis

By examining different conditionsFilling gold pasteThe following conclusions were drawn from the test of adhesion to the substrate:

• Pre treatment effect: Using plasma cleaning as a pre-treatment step can significantly improve the adhesion between the filling gold paste and the substrate. Experimental data shows that the average peel strength of the sample after plasma cleaning reached 3.2N/mm, while the sample without any pretreatment was only 2.5N/mm.

• The influence of curing temperature: The curing temperature also has a direct impact on the adhesion of the filling gold paste. The adhesion of the sample cured at 150 ℃ for 2 hours is about 0.3N/mm higher than that of the sample cured at 120 ℃ for the same time.

• Formula adjustment: By increasing the resin content, the flowability of the filling gold paste can be effectively improved, while enhancing its adhesion with the substrate. In the experiment, it was found that the resin content increased from 5% of the original formula to 7%, and the adhesion improved by nearly 0.4N/mm.

data comparison

In order to better illustrate the effectiveness of the above improvement measures, we compared the adhesion values under different conditions. The results showed that after optimizing the pretreatment method, curing parameters, and adjusting the formula of the filling gold paste, the adhesion between the filling gold paste and the substrate was significantly improved.

conclusion

By comparingFilling gold pasteWe have concluded that the problem of poor adhesion can be effectively solved by optimizing the pretreatment steps, adjusting the curing parameters, and improving the filling gold paste formula. Specifically, using plasma cleaning, appropriately increasing the curing temperature, and moderately increasing the resin content are all feasible methods. These improvement measures not only enhance the adhesion between the filling gold paste and the substrate, but also improve the overall performance of the PCB.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.