The influence of copper layer thickness on the conductivity and flexibility of PP copper plated film

In the field of electronic materials, copper plated films have attracted much attention due to their excellent conductivity and wide application prospects.PP (polypropylene) copper plated filmAs an important composite material, its performance is not only determined by the properties of the polypropylene substrate, but also significantly influenced by the thickness of the copper layer. This article will explore the influence of copper layer thickness on the conductivity and flexibility of PP copper plated films, and cite relevant data for analysis.

1、 The influence of copper layer thickness on conductivity

Copper, as an excellent conductive material, its thickness directly determines the conductivity of the copper plated film. In theory, the thicker the copper layer, the better the conductivity. This is because a thicker copper layer can provide more free electrons, thereby reducing resistance and improving current carrying capacity.

Advanced Institute (Shenzhen) Technology Co., LtdResearch has shown that when copper is plated on PP substrates, the electrical resistivity of the copper plated film significantly decreases as the thickness of the copper layer increases from 10 μ m to 50 μ m. Specifically, 10μmThe resistivity of the copper plated film with a copper layer thickness is 5 × 10-6 Ω· cm. This change indicates that the increase in copper layer thickness significantly improves the conductivity of the copper plated film.

In addition, the uniformity of copper layer thickness also has a significant impact on conductivity. If the thickness distribution of the copper layer is uneven, it will lead to an increase in local resistance and affect the overall conductivity. Therefore, in the copper plating process, it is necessary to strictly control the process parameters to ensure the uniformity of the copper layer thickness.

2、 The influence of copper layer thickness on flexibility

PP substrate itself has good flexibility and processability, but after copper plating, its flexibility will be affected to some extent. The increase in copper layer thickness will enhance the rigidity and hardness of the copper plated film, thereby reducing its flexibility.

Experimental data from Advanced Institute (Shenzhen) Technology Co., Ltd. shows that when the thickness of the copper layer increases from 10μmIncrease to 50μmWhen,PP copper plated filmThe bending performance has significantly decreased. Specifically, 10μmThe copper plated film with a copper layer thickness can withstand 180 ° repeated bending without cracking, while 50μmThe copper plated film with copper layer thickness cracks when bent at 90 °. This indicates that an increase in copper layer thickness will significantly reduce the flexibility of the copper plated film.

However, in practical applications, flexibility is not the only factor to consider. Sometimes, in order to improve conductivity and mechanical strength, it is necessary to increase the thickness of the copper layer appropriately. Therefore, when selecting the thickness of the copper layer, it is necessary to comprehensively consider conductivity, flexibility, and other performance requirements to achieve the best balance.

3、 Conclusion

The thickness of the copper layer has a significant impact on the conductivity and flexibility of PP copper plated film. Increasing the thickness of the copper layer can improve conductivity, but it will reduce flexibility. In practical applications, it is necessary to choose the appropriate copper layer thickness according to specific needs.

Research by Advanced Institute (Shenzhen) Technology Co., Ltd. shows that by precisely controlling the copper plating process parameters, the flexibility of the copper plating film can be maximized while ensuring conductivity. In addition, multi-layer copper plating technology can be used to further optimize the performance of the copper plating film by adjusting the thickness and properties of each layer of copper.

In summary, the thickness of the copper layer is one of the key factors affecting the performance of PP copper plating film. By conducting in-depth research on the influence of copper layer thickness on conductivity and flexibility, strong support can be provided for the design and manufacturing of copper plated films, promoting their application and development in the field of electronic materials.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.