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Conductive adhesiveIt is a conductive adhesive that adds conductive fillers to the adhesive. The main component of conductive adhesive is adhesive, and general adhesives can be used as the basic component of conductive adhesive. Choosing different adhesives can meet different bonding requirements, such as conductive adhesives like epoxy and chlorinated adhesives.
Because conductive adhesives have vastly different requirements in practical applications, the correct selection of conductive adhesives has become a crucial step in the production process of electronic and optoelectronic devices. Below is a comprehensive analysis of the composition of conductive adhesive from multiple dimensions to help target readers better understand and select conductive adhesive.
1. Viscosity
The viscosity of conductive adhesive is an important indicator, and the viscosity requirements for conductive adhesive vary in different application scenarios. For example, for the bonding of some small components, low viscosity conductive adhesive is required to ensure uniform coating after filling and to fully fill all small gaps.
2. Filler
The filling material of conductive adhesive is also a key component. Common fillers include conductive metal powder, carbon nanotubes, etc. for exampleConductive silver adhesiveThe filling material in is conductive silver powder with good conductivity.
3. Hardness
The hardness of conductive adhesive will affect its stability and durability in practical applications. For some devices that require frequent force, choosing a conductive adhesive with higher hardness can ensure that it will not deform or break during long-term use.
4. Adhesive strength (LapShear/DieShear)
The bonding strength of conductive adhesive is an important indicator to measure its bonding effect. Different conductive adhesives have varying bonding effects on different materials. When selecting conductive adhesive, it is necessary to choose one with good adhesive strength according to the actual application situation.
5. Coefficient of Thermal Expansion (CTE) and Thermal Conductivity
Conductive adhesiveIn applications, it may be affected by temperature changes and thermal conductivity, so the thermal expansion coefficient and thermal conductivity coefficient of conductive adhesive are also important factors to consider. Conductive adhesives with high coefficients of thermal expansion and thermal conductivity can better adapt to temperature changes and provide better conductivity.
In summary, when selecting a suitable conductive adhesive, multiple factors should be considered, including viscosity, filler, hardness, bonding strength, thermal expansion coefficient, and thermal conductivity coefficient. By considering these factors comprehensively, the target readers can more accurately choose the conductive adhesive that suits their needs, thereby improving the quality and performance of the product. In practical applications, we can choose conductive adhesives with appropriate characteristics to meet specific usage scenarios and requirements.
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