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12.5 μ m PI aluminum plated film with aerospace grade standard thickness
In the product spectrum of PI aluminum plated film, commonly used thicknesses include 7.5 μ m, 12.5 μ m, 25 μ m, 50 μ m, 75 μ m, 125 μ m, etc. The reason why 12.5 μ m has become one of the most widely used specifications is due to its comprehensive advantages in multiple engineering dimensions:
Advanced Institute of Technology:The PI aluminum plated film produced can be customized in thickness according to demand. The thickness range of PI film is 5 μ m-125 μ m, and suitable substrate thickness can be flexibly selected according to specific application requirements. In MLI applications, the shielding layer is usually made of metalized polymer materials with a thickness of less than 125 μ m, and 12.5 μ m is the core specification within this range.
The aluminum layer preparation of 12.5 μ m PI aluminum plated film mainly adopts vacuum evaporation process - in a vacuum environment, high-purity aluminum wire or aluminum block is evaporated into gas by heating, and then deposited on the surface of PI film to form a coating. This process requires precise control of parameters such as vacuum degree, evaporation temperature, and evaporation rate to ensure the quality and thickness of the coating.
Vacuum evaporation is performed on a 12.5 μ m substrate, and the process window is relatively mature. Compared with the 7 μ m ultra-thin substrate, the 12.5 μ m substrate has higher mechanical strength and thermal capacity, and has better tolerance for temperature and tension fluctuations during the vapor deposition process. Therefore, the uniformity and adhesion of the aluminum layer are easier to ensure.
Process maturity:Advanced Institute Technology, relying on its independently built roll to roll vacuum evaporation production line, has achieved stable supply capacity for PI aluminum film from nanoscale thickness control to large-scale production. The applicable substrates include various flexible materials such as FEP, PI, PET, LCP, PPS, PEN, PP, etc. After professional testing, the adhesion and uniformity of the coating can meet the requirements of high-end applications. In addition, PI aluminum plated film can be divided into two types: single-sided aluminum plating and double-sided aluminum plating. Single sided aluminum plating maintains insulation on one side of the film while increasing conductivity and reflectivity on the other side; Double sided aluminum plating provides double-sided conductivity and reflection functions.
Based on a 12.5 μ m PI substrate, aluminum plated film products with different aluminum layer thicknesses can be prepared by precisely controlling the evaporation process parameters. The thickness of the aluminum layer varies from 0.1 μ m to 1 μ m, and different thicknesses correspond to different performance focuses:
| Product Type | Aluminum layer thickness | Key Features | Typical Applications |
|---|---|---|---|
| 12.5 0.1PI aluminum plated film | ~0.1 μm | Extremely thin aluminum layer, highest flexibility, semi transparent | Lightweight MLI reflective layer, precision optical reflective film |
| 12.5 0.3PI aluminum plated film | ~0.3 μm | Thin aluminum layer, good flexibility, moderate reflectivity | Spacecraft MLI components, flexible electromagnetic shielding |
| 12.5 1PI aluminum plated film | ~1 μm | Thick aluminum layer, high reflectivity, good conductivity | High reliability thermal control layer, high-performance EMI shielding |
Note: The thickness of the aluminum layer is the nominal reference value, and the specific performance is subject to the actual product specifications.
Selection suggestion:Balancing optical reflectivity, conductivity, and flexibility requirements comprehensively. The thinner the aluminum layer, the better the flexibility and the lighter the weight; The thicker the aluminum layer, the stronger the reflectivity and conductivity. Advanced Institute Technology supports customization of PI film thickness, width, and aluminum layer thickness as needed.
-Long term use at 269 ° C to 260 ° C, short-term use above 400 ° C. The PI film maintains a strength retention rate of 90% after 5 × 10 ⁹ rad fast electron irradiation.
Reflectivity ≥ 90% (up to 95% or more), unidirectional PI aluminum plated film as MLI reflective layer can reach over 95%, aluminum surface reflectivity can reach 97%, double-sided aluminum plating can reach over 98%.
Aluminum coating endows good conductivity (second only to copper/silver in conductivity); Block gas and moisture, block light and UV rays.
The PI film itself has excellent mechanical strength, wear resistance, and tear resistance, and remains after aluminum plating. Dielectric constant~3.4, insulation resistance 1000 trillion Ω· cm.
| performance metrics | typical value | Reference source |
|---|---|---|
| Long term use temperature | -269 ° C to 260 ° C | — |
| Short term temperature tolerance | Above 400 ° C | — |
| Reflectance (single-sided) | ≥ 90% (up to 95% or more) | — |
| Reflectance (double-sided) | Up to 98% or more | — |
| Radiation resistance (fast electron) | Strength retention rate of 90% after 5 × 10 ⁹ rad | — |
| Dielectric constant (1MHz) | ~3.4 | — |
| insulation resistance | 1000 trillion Ω· cm | — |
Substrate thickness range: 5 μ m-125 μ m
MLI core layer material, aluminum layer reflects radiant heat, PI is resistant to extreme environments. Stacking dozens of layers can reduce the equivalent thermal conductivity to the order of 10 ⁻⁵ W/(m ·° C). Unidirectional PI aluminum coating with a reflectivity of ≥ 95%, used for satellite bodies, rocket bodies, and propulsion system pipelines.
FPC shielding layer, grounding layer, EMI protection; High power chips have uniform heat dissipation; Durable and gentle heating film. Widely used in flexible circuit boards, touch screen sensors, and electromagnetic shielding materials.
High precision flexible reflector, lightweight focusing system, scanning mirror, laser cavity reflector; High end projection reflector and brightening film substrate. Aluminum reflectivity can reach 97%, and PI provides a smooth surface.
12.5 μ m is the core specification, with advanced technology substrate thickness covering 5-125 μ m. 12.5 μ m is suitable for aerospace weight reduction and flexible electronic lightweight scenarios.
Single side is used for single-sided reflection or conduction; Double sided is used for double-sided reflection or conduction, and MLI double-sided reflection has higher efficiency.
0.1-1 μ m can be customized, the thicker the thickness, the higher the reflectivity, but the flexibility decreases. Choose according to your needs.
PI aluminum plated film is suitable for -269 ° C~260 ° C; width and length can be customized according to needs, suitable for large-area MLI production.
The essence of 12.5 μ m PI aluminum plated film is to find the optimal balance between the lightweighting and processability of PI film as an engineering product. It is not the thinnest or thickest, but it is the most universal choice for high-end applications such as aerospace thermal control, flexible shielding, and precision optics: capable of meeting the performance requirements of extreme space environments, supporting the bending needs of flexible circuits, and maintaining high yield in mass production.
For engineers, understanding the engineering logic behind the thickness of 12.5 μ m - why it is 12.5 instead of 7 or 25- is more valuable than simply remembering a specification. On this thickness platform, customizing products with different properties by adjusting the thickness of the aluminum layer (from 0.1 μ m to 1 μ m) is a key step in transforming "standard thickness" into specific engineering solutions.
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